Thermal & Flow Software Tools for IC Package Modeling
Portable Design News, Thursday August 07, 2008
Daat Research Corp. announces the addition of powerful tools for modeling IC packages into its Coolit v.8 CFD thermal analysis software. The tools build detailed parametric chip models that can be converted to compact models, and the user can switch between detailed and compact models as desired.
Included is a library of hundreds of popular Ball Grid Arrays (BGA), Dual Inline Packages (DIP) and Quad flat Packages (QFP). The user can copy and modify the models, or add new models to the library. Coolit v.8 also delivers many improvements in algorithms for computation and presentation of results. Coolit v.8 is now shipping.
Daat, Hanover, NH (603) 643-2999 [www.daat.com]
