Qualcomm and IMEC Collaborate on 3D Integration Research
Portable Design News, Tuesday August 05, 2008
IMEC, Europe's leading independent nanoelectronics research institute, and Qualcomm have announced that Qualcomm is the first fabless integrated circuit company to participate in IMEC's industrial affiliation program (IIAP) on three-dimensional (3D) integration. Qualcomm and IMEC researchers in the program will collaborate to understand and develop solutions for the use of 3D technologies in future wireless products.
“We are confident that strong industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward,” said Luc Van den hove, chief operation officer at IMEC.
IMEC's 3D integration program explores three dimensional technology and design for application in various domains. The technology research program focuses on 3D wafer-level packaging and 3D stacked-ICs to find innovative solutions for the cost-effective use of 3D interconnects at different levels of the wiring hierarchy. The 3D system-on-chip design research program provides insights to its benefits, costs, challenges and solutions. The program will also include the development and demonstration of the IP and tools necessary for designing in three dimensions.
Other partners in IMEC's 3D integration program are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.
IMEC, Leuven, Belgium +32 16 28 12 11 [www.imec.be]
Qualcomm Incorporated, San Diego, CA (858) 587-1121 [www.qualcomm.com]
